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QFN 3D STACKED DIE - COLLABORATION WITH UKM, UM SIRIM AND AIC |
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July 20, 2008 20:28 PM
M'sia Launches Latest Semiconductor Package
KULIM, July 20 (Bernama) -- Malaysia today unveiled a state- of-the-art semiconductor package which is smaller in size yet capable of having a higher capacity.
The 'QFN 3-D Stacked Die' product was the result of joint research by scientists from Universiti Kebangsaan Malaysia as the leader, Universiti Malaya, Sirim Bhd and AIC Semiconductor Sdn Bhd.
It was funded by the Ministry of Science, Technology and Innovation (MOSTI) under the Development and Production of Advance Semiconductor 3D Packaging programme.
MOSTI Secretary-General Datuk Abdul Hanan Alang Endut who launched the product said the ministry spent RM26.6 million in grants for the project which took about two and a half years to be completed at AIC Semiconductor facility in Kulim High-Tech Park.
'Malaysia which has over 25 years of experience in the semiconductor industry and over 100,000 workforce can grow more rapidly in the industry provided it undertakes more research and enhance the level of development and high value manufacturing,' he said.
Malaysia was among major semiconductor producers, contributing about eight percent to the world market worth about US$204 billion in 2002, he said.
Speaking to reporters later, Hanan said the government's ownership in the semiconductor package through MOSTI was 50 percent while the rest was shared by the two unversities, Sirim and AIC Semiconductor.
AIC Semiconductor president Chong Chee Song said the new package fetched a high market value in the electronic industry and had received orders from several parties.
'We are able to produce one million semiconductor chips in a month but if the demand is high we are ready to inject more funds to acquire the necessary equipment,' he said.
-- BERNAMA
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